Feb 20, 2023
St. Louis, MO. Feb. 17, 2023. The American Soybean Association is accepting applications for the Valent and ASA Ag Voices of the Future program, which will be held July 10-13, 2023, in conjunction with the summer ASA Board meeting and Soy Issues Forum in Washington, D.C. The Ag Voices of the Future program is for students interested in improving their understanding of major agricultural policy issues, the importance of advocacy, and careers that can impact agricultural policy.
ASA and Valent partner with the collegiate organization Agriculture Future of America on the application process and promotion of this program. The class size is limited, and there has already been significant interest in this summer’s program. While the application period opened in November, students still have until March 9, 2023, to submit their final application.
Select students from the 2023 Ag Voices of the Future program will also be awarded a scholarship to participate in the AFA Leaders Conference, Nov. 9-12, 2023, in Kansas City, Missouri. The scholarship will cover the students’ registration fees and travel expenses to and from the conference.
To apply for the ASA and Valent Ag Voices of the Future program, and in turn be considered for a scholarship to the AFA Leaders Conference, students should visit the Ag Voices of the Future webpage on the ASA website, click the green “Apply Now” button, and submit their application by March 9. Students must be at least 18 years old by July 10, 2023, to participate in the program. To make sure students are considered for the Ag Voices of the Future program, they should check the box on the application form that reads, “I have an interest in agriculture policy and would like to be considered for the ASA and Valent Ag Voices of the Future Program (July 10-13, Washington, D.C.) and an AFA Leaders Conference Scholarship.” If a student has already applied for the AFA Leaders Conference, they can modify their application to include checking the box for the Ag Voices of the Future program.